IC Lead Frame is a precision metal component used for integrated circuit packaging, chip connection, semiconductor device support, and electronic signal transmission. It is commonly manufactured from copper alloy, iron-nickel alloy, stainless steel, or ot
IC Lead Frame is a precision metal structural component widely used in semiconductor packaging and electronic component manufacturing. Its main function is to provide mechanical support, electrical connection, and heat dissipation pathways for the chip, allowing the chip to connect reliably with external circuits while maintaining stable positioning and performance inside the package.
During integrated circuit packaging, material properties, lead dimensions, pitch accuracy, flatness, surface quality, and batch consistency can directly affect packaging yield and device reliability. Unstable lead dimensions, obvious burrs, or insufficient flatness may influence subsequent wire bonding, soldering, mounting, and encapsulation processes. Therefore, IC lead frames require high processing accuracy, consistent profiles, and clean surface quality.
This product can be customized using copper alloy, iron-nickel alloy, stainless steel, nickel alloy, or other conductive metal materials according to customer requirements. Copper alloy offers excellent electrical conductivity, thermal conductivity, and processability, making it widely used in integrated circuit and electronic packaging structures. Iron-nickel alloy provides good dimensional stability and thermal expansion matching properties for specific semiconductor packaging applications. Material thickness, hardness, surface treatment, and plating requirements can be customized according to product design and packaging processes.
Through precision metal etching, complex, fine, and dimensionally stable leads, connecting bridges, die pads, positioning holes, and array structures can be produced on thin metal materials. Compared with traditional stamping, chemical etching is better suited for small-batch development, complex structures, high-density leads, and thin metal components. The process also helps reduce mechanical stress deformation, maintaining better flatness and dimensional consistency.
Innoetch supports the custom development of different types of IC lead frames and semiconductor packaging metal components based on customer drawings, including chip lead frames, sensor lead frames, power device lead frames, connection terminals, conductive plates, array-style metal frames, and customized electronic structural parts. Products can also be supplied with array layouts, positioning hole designs, half-etched structures, surface cleaning, deburring, plating, or other post-processing services according to customer requirements.
This type of product is widely used in integrated circuit packaging, sensor packaging, power semiconductor devices, LED packaging, electronic connectors, miniature electronic assemblies, automotive electronics, industrial electronics, and consumer electronic products. For customers who require high-precision lead structures, stable conductivity, and consistent mass production quality, precision etched IC lead frames provide a reliable, flexible, and scalable metal manufacturing solution.
Innoetch provides custom IC lead frame and semiconductor package metal frame manufacturing services using precision metal etching technology to produce high-precision, conductive, and reliable copper alloy and other metal lead frame products for chip packaging and electronic connection applications.
IC Lead Frame is widely used in precision metal etching applications where clean edges, tight tolerances, complex patterns and stable performance are required. Typical industries include electronics, semiconductors, sensors, fuel cells, acoustic components, EMI shielding, thermal management and precision mechanical parts.
IC Lead Frame is a precision metal component manufactured by photochemical etching for applications requiring accurate dimensions, smooth edges and reliable performance.
Common materials include stainless steel, copper, brass, nickel silver, titanium, aluminum and other thin metal sheets depending on the application requirements.
INNOETCH can process thin metal materials from approximately 0.02 mm to 1.5 mm, depending on material type, part structure and tolerance requirements.
For many precision etched parts, tolerances can reach ±0.01 mm to ±0.05 mm, depending on material thickness, design complexity and production volume.
Chemical etching does not require expensive hard tooling and can produce fine patterns, complex shapes and burr-free edges without mechanical deformation.
Yes. INNOETCH supports custom drawings, materials, thicknesses, hole patterns, surface finishes, dimensions and prototype-to-mass-production requirements.
2D drawings, DXF files, DWG files, STEP files, material requirements, thickness, tolerance, quantity and application details are recommended for accurate quotation.
You can send your drawings and technical requirements to INNOETCH. Our engineering team will review the design and provide a quotation.
